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  • Lead Free Solder, Sn-Ag System,

Lead Free Solder, Sn-Ag System, HS-371

5.00 (2)
Item.#
06611245
Mfr.#
HS-371
Package Qty.
1Roll
Ship pack of
1
28.09 SGD
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Shipped after 2017-07-31
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Item Feature
Solid Phase/Liquid phase Temperature (degree c)
227/227
Weight (g)
100
Ingredients
Sn:99.3% , Cu+Ni:0.7%
Length (m)
190
Specific Gravity
7.4
Description 2
solder for Impact on the environment oining electronic components that do not contain lead
Wire Diameter (phi mm)
0.3
Customer Reviews
5 star 2
4 star 0
3 star 0
2 star 0
1 star 0
Review Rating: 5.00
2 Customer Reviews
The reviews are automatic translation.
Copper pot repair
5
From Japan
On 2017-03-13 18:47:58
I fixed the indentation of the copper pot and the inner convex portion became flat, but the outer concave portion did not return and the thickness got thinner, so I filled it with this solder. It is lead-free so it can be used with confidence.
This review is about item#6611254.
Soldering parts
5
From Japan
On 2015-04-10 13:44:20
We are using it for repair work etc. with attachment of SMD parts of board. There are circumstances that 0.3 mm can be obtained only about this product, but there is no dissatisfaction.
This review is about item#06611245.