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  • Lead Free Solder, Sn-Ag System,

Lead Free Solder, Sn-Ag System, HS-374

5.00 (2)
Item.#
06611263
Mfr.#
HS-374
Package Qty.
1Roll
Ship pack of
1
19.70 SGD
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Item Feature
Solid Phase/Liquid phase Temperature (degree c)
227/227
Weight (g)
100
Ingredients
Sn:99.3% , Cu+Ni:0.7%
Length (m)
17
Specific Gravity
7.4
Description 2
solder for Impact on the environment oining electronic components that do not contain lead
Wire Diameter (phi mm)
1.0
Customer Reviews
5 star 2
4 star 0
3 star 0
2 star 0
1 star 0
Review Rating: 5.00
2 Customer Reviews
The reviews are automatic translation.
Repair of copper pot
5
From Japan
On 2017-03-13 18:47:58
Convex portion of the inside After fix the dent in the copper pot, but became flat without returning dent of the outside, since the thickness becomes thin, it was filled with the solder. Since the lead-free safe to use.
This review is about item#6611254.
Soldering of components
5
From Japan
On 2015-04-10 13:44:20
I use to like renovation work involving the installation of the board SMD components. 0.3mm is also circumstances that can not be obtained only about this product, but there is no complaint.
This review is about item#06611245.