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Solder Wire
MonotaRO
19.20 - 70.67 SGD
Category Solders > Wire Solder
Lead-Free Solder, Roll
HAKKO
4.33(6)
28.32 - 129.90 SGD
Melting Point (degree c): 227
Category Solders > Wire Solder
Solder, KR-19SHRMA, Sn60, Anti Scattering
Nihon Almit
4.00(2)
179.90 - 199.90 SGD
Content (wt %): Flux: 3.3 (P-3), Alloy Composition (Wt %): Sn60-Pb40, Solid Phase/Liquid phase Temperature (degree c): 183/190
Category Solders > Wire Solder
Lead Free Solder
HAKKO
4.50(2)
3.47 - 9.31 SGD
Melting Point (degree c): 227
Category Solders > Wire Solder
Stainless Steel Solder
HOZAN TOOL INDUSTRIAL CO.,LTD.
16.84 SGD
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Solid Phase/Liquid phase Temperature (degree c): 183/234, Specific Gravity: 9.3, Wire Diameter (phi mm): 1.6, Length (m): 2.5, TRUSCO Part Number: 120-4033, Ingredients: Sn 40%, Pb 60%
Category Solders > Wire Solder
Copper Pipe Solder
ESCO
4.29(7)
22.93 - 58.87 SGD
Melting Point (degree c): 240, Wire Diameter (phi mm): 2, Type: High mechanical strength, Ingredients: 95% tin, 5% antimony
Category Solders > Wire Solder
Solder for Stainless
HAKKO
4.76 - 43.70 SGD
Purpose: Solder for stainless, metal processing, Melting Point (degree c): 190, Wire Diameter (phi mm): 1.2, Type: Kikko, Ingredients: Tin 60
Category Solders > Wire Solder
Wire Solder
ENGINEER.INK
4.79 - 109.90 SGD
Type: RA
Category Solders > Wire Solder
Resin Flux Cored Solder Solder Ace E28 Rh60B
Nihon Genma
72.55 - 119.90 SGD
Purpose: Soldering, Alloy Composition (Wt %): 60Sn-40Pb
Category Solders > Wire Solder
Solder Bar
HAKKO
9.58 - 70.67 SGD
Caution: Flux is not included. For connecting metals , please perform flux treatment in advance., Purpose: FS300-01 is for the sheet metal. FS400-01 to FS401-02 is for stainless steel processing, solder bath, melting ore, precision work, tin engineering, stainless steel , copper plate , and brass
Category Solders > Solder Bar
Lead-free Solder
HOZAN TOOL INDUSTRIAL CO.,LTD.
5.00(2)
19.70 - 28.09 SGD
Solid Phase/Liquid phase Temperature (degree c): 227/227, Specific Gravity: 7.4, Weight (g): 100, Description 2: solder for Impact on the environment oining electronic components that do not contain lead, Ingredients: Sn:99.3% , Cu+Ni:0.7%
Category Solders > Wire Solder
Solder
HOZAN TOOL INDUSTRIAL CO.,LTD.
4.50(2)
28.68 - 34.27 SGD
Solid Phase/Liquid phase Temperature (degree c): 183/190, Specific Gravity: 8.5, Ingredients: Sn60%, Pb40%
Category Solders > Wire Solder
Superiot RA No-Clean Solder
ENGINEER.INK
2.67(3)
8.38 - 9.51 SGD
Aqueous Solution Resistance (ohm cm): 6x104, 6x104, Melting Point (degree c): 183-190, 183 - 190, JIS Standard: Class A, Ingredients: Sn:60%, Pb:40%
Category Solders > Wire Solder
Almit, Sn60, Solder Tar
Nihon Almit
5.00(2)
119.90 - 189.90 SGD
Alloy Composition (Wt %): Sn60-Pb40, Solid Phase/Liquid phase Temperature (degree c): 183/190
Category Solders > Wire Solder
Lead Free Solder, Preventing Scattering Type
Nihon Almit
209.90 - 339.90 SGD
Content (wt %): Flux: 3.5, Solid Phase/Liquid phase Temperature (degree c): 217/220
Category Solders > Wire Solder
Super Rosin 60Gxm3, Unwashed Type
Ishikawa Metal
3.00(1)
75.31 - 139.90 SGD
Purpose: Retrofit modification of precion electronic equipments Robot soldering work, Tin (%): 60%, Content (%): Flux: 2.8 Halide: 0.11
Category Solders > Wire Solder
Lead Free Resin Flux Cored Solder
Nihon Superior
5.00(1)
65.71 - 82.72 SGD
Purpose: Post install and correction of PCB., Whisker Generation Test (hrs): 1000, Migration Test (hrs): 1000, Heat Shock Test (cycles): 1000, Creep Strength Facture Time(Time Before Weight Falling): 300hrs, Electrical Resistance Rest (micro ohm m): 0.13, Specific Heat (J/kg/K): 220, Melting Point (degree c): 227, Tensile Strength (MPa): 32, Elongation (%): 48, Specific Gravity: 7.4
Category Solders > Wire Solder
Superosin Gx, Shatterproof Type
Ishikawa Metal
5.00(2)
87.52 - 90.93 SGD
Weight (kg): 1
Category Solders > Wire Solder
ALMIT Leaded Solder 60A
Nihon Almit
1.00(1)
119.90 - 199.90 SGD
Caution: Stainless steel can only use SUS304, SUS301, SUS430., Alloy Composition (Wt %): Sn60-Pb40, Solid Phase/Liquid phase Temperature (degree c): 183/190
Category Solders > Wire Solder
Lead-free Solder
HOZAN TOOL INDUSTRIAL CO.,LTD.
3.50(2)
12.00 - 229.90 SGD
Solid Phase/Liquid phase Temperature (degree c): 217/220, Specific Gravity: 7.4
Category Solders > Wire Solder
Solder
HOZAN TOOL INDUSTRIAL CO.,LTD.
9.60 - 10.15 SGD
Ingredients: Sn:60%, Pb:40%
Category Solders > Solder Bar
Solder
HOZAN TOOL INDUSTRIAL CO.,LTD.
4.56(9)
18.96 - 93.98 SGD
Category Solders > Wire Solder
Lead-free Solder
HOZAN TOOL INDUSTRIAL CO.,LTD.
22.44 - 90.82 SGD
Solid Phase/Liquid phase Temperature (degree c): 217/226
Category Solders > Wire Solder
Lead Free Solder
ENGINEER.INK
5.00(2)
12.67 - 15.35 SGD
2015 Trusco Published Pages: 1 2291, Melting Point (degree c): 217, 217
Category Solders > Wire Solder
Stick Solder
Sanwa Metal
5.00(2)
8.60 - 8.67 SGD
Type: Copper and iron for
Category Solders > Solder Bar
Tin And Lead Solder, Roll
HAKKO
14.63 - 109.90 SGD
Category Solders > Wire Solder
High silver containing stainless steel solder pocket size MAGNA 88C economizer 0.8 MM
MAGNA WELDING ALLOYS
76.00 SGD
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Caution: * Please read and use Magna 88C operating procedure manual., Purpose: It is suitable for all kinds of metals, iron, stain, copper, brass, tool steel, nickel etc, and it is also suitable for electronic equipment and has high conductivity., Material Specification: Sn.Ag, Sn.Ag, Sn.Ag, Tensile Strength (kgf/mm2): 9.8, 9.8, 9.8, Current Range (A): 212-215, 212-215, 212-215, Rod Diameter (phi mm): 0.8, 0.8, 0.8, Hardness: 50B, 50B, 50B
Category Solders > Wire Solder
Lead Free Solder
goot
16.84 - 17.59 SGD
Caution: This product is manufactured in Japanese standards. Please check the specification before you order., Melting Point (degree c): 216-227, Chemical Composition: Sn99%-Ag0.3%-Cu0.7%, Weight (g): 100
Category Solders > Wire Solder
Lead Free 800 G
goot
139.90 SGD
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Melting Point (degree c): 216-227, Chemical Composition: Sn99%-Ag0.3%-Cu0.7%, Wire Diameter (phi mm): 0.8
Category Solders > Wire Solder
No-clean solder
goot
5.00(1)
28.99 SGD
ADD TO CART
Caution: This product is manufactured in Japanese standards. Please check the specification before you order., Melting Point (degree c): 183-190, Chemical Composition: Sn60%-Pb40%, Wire Diameter (phi mm): 0.3
Category Solders > Wire Solder

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