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Lead-free application solder

4.00 (1)
Melting Point (degree c)
216-227
Chemical Composition
Sn99%-Ag0.3%-Cu0.7%
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Wire Diameter (phi mm) Restriction Package
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Ship pack of Mfr.# Item.# Sales Price Availability Qty.
Wire Diameter (phi mm) Restriction Package
Qty.
Ship pack of Mfr.# Item.# Sales Price Availability Qty.
0.6 *[No return] You cannot return this product. For details, see FAQ. 1pc 1 SD-51 17619202 6.99 SGD
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1.2 *[No return] You cannot return this product. For details, see FAQ. 1pc 1 SD-54 17619236 7.99 SGD
Shipped after 2018-07-20
1.6 *[No return] You cannot return this product. For details, see FAQ. 1pc 1 SD-55 17619245 8.99 SGD
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1.2 *[No return] You cannot return this product. For details, see FAQ. 1pc 1 SD-56 17619254 8.99 SGD
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1.6   1pc 1 SD-57 17619263 9.99 SGD
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Review Rating: 4.00
1 Customer Reviews
The reviews are automatic translation.
Used for joining together copper plates
4
From Japan
On 2018-01-04 14:44:14
Apply the flux and warm it with a soldering iron. You can use it without any problem.
This review is about item#17619254.

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