Ideal for lead-free solder removal A compact and multifunctional solder removal tool that can remove SMD parts with an integrated solder removal machine that has a motor, diaphragm vacuum pump, and chip temperature control circuit built into the iron section. Achieves low vibration and low noise because the mechanical part has a floating structure. There is no pattern peeling or disconnection. Since the pump and suction nozzle are directly connected, a quick vacuum arrival time and instant strong suction (vacuum arrival degree 650 mmHg) are realized. Moreover, since it uses a high-power (100V / 100W) large-capacity ceramic heater, it removes solder from multilayer boards (4 to 8 layers).
Mass (g): 420 (Excluding code)
Setting Temperature (℃): 350-500 (continuous possible)
Type of Control: Feedback zero cross method
pump power consumption: 120W
Exhaust Air (L): 15 / min (at OPEN)
Pump: Diaphragm method
Time to Reach Maximum Pressure: 0.2 seconds
Ultimate Vacuum: 650mmHg
Heater: 100W ceramic
Power Cable (m): 2P cord (grounding type) 1.8m
Power Input (V): AC100(50/60Hz)
This product is manufactured in Japanese standards.
Some products may not meet the standards of your item.
Please check the specification carefully before you order.